| 3648585 |
SMD291AX50T3 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Jar, 50g (1.8 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648586 |
SMD291AX |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Syringe, 5cc, 15g (0.5 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648587 |
SMDLTLFP |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Syringe, 15g (0.5 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648588 |
SMD291SNL |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Syringe, 15g (0.5 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648589 |
SMD291SNL50T3 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 50g (1.8 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648593 |
SMD291AX10 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648594 |
SMDLTLFP50T3 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 50g (1.8 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648595 |
SMDSWLF.031 4OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 113g (1/4 lb) |
No Shelf Life |
Active |
| 3648596 |
SMDSWLF.020 4OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 113g (1/4 lb) |
No Shelf Life |
Active |
| 3648597 |
SMD291SNL10 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648600 |
SMD291SNL10T5 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648605 |
SMD291SNL250T3 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648609 |
SMD291AX250T5 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648610 |
SMD291SNL250T5 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648613 |
SMDSWLF.031 1OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 28g (1 oz) |
No Shelf Life |
Active |
| 3648614 |
SMDSW.031 4OZ |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 113g (1/4 lb) |
No Shelf Life |
Active |
| 3648642 |
SMD4300AX10 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
Water Soluble |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648643 |
SMD4300SNL10 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
Water Soluble |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648644 |
SMD291AX10T5 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648645 |
SMD4300AX10T5 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
Water Soluble |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648646 |
SMDLTLFP10T5 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648648 |
SMDSWLTLFP32 |
Chip Quik Inc. |
- |
Wire Solder |
281°F (138°C) |
Lead Free |
Sn42Bi57Ag1 (42/57/1) |
- |
0.030" (0.76mm) |
22 AWG, 24 SWG |
- |
- |
No Shelf Life |
Active |
| 3648649 |
SMD4300AX250T3 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
Water Soluble |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648651 |
SMDLTLFP250T3 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648655 |
SMDSW.031 1OZ |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 28g (1 oz) |
No Shelf Life |
Active |
| 3648657 |
SMDSW.020 1OZ |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 28g (1 oz) |
No Shelf Life |
Active |
| 3648659 |
SMDSW.020 2OZ |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 57g (2 oz) |
No Shelf Life |
Active |
| 3648660 |
SMDSWLF.020 1OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 28g (1 oz) |
No Shelf Life |
Active |
| 3648661 |
SMDSW.020 4OZ |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 113g (1/4 lb) |
No Shelf Life |
Active |
| 3648662 |
SMDSWLF.031 2OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 57g (2 oz) |
No Shelf Life |
Active |
| 3648663 |
SMDSWLF.020 2OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 57g (2 oz) |
No Shelf Life |
Active |
| 3648665 |
SMDLTLFP15T4 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 15g (0.5 oz) |
24 Months (Date of Manufacture) (Unmixed) |
Active |
| 3648666 |
SMD291SNL15T4 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 15g (0.5 oz) |
24 Months (Date of Manufacture) (Unmixed) |
Active |
| 3648667 |
SMDLTLFP10 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648669 |
SMD291AX10T4 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648670 |
SMDLTLFP10T4 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648671 |
SMD4300AX10T4 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
Water Soluble |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648680 |
SMD291SNL10T4 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648683 |
SMD4300SNL10T4 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
Water Soluble |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648697 |
SMD4300SNL10T5 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
Water Soluble |
- |
- |
- |
Syringe, 10cc, 35g (1.2 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648699 |
SMDLTLFP60T4 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
- |
24 Months (Date of Manufacture) (Unmixed) |
Active |
| 3648708 |
SMD291AX250T4 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648710 |
SMD4300SNL250T3 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
Water Soluble |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648715 |
SMD291SNL250T4 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648719 |
SMDLTLFP250T4 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648721 |
SMD4300AX250T5 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
Water Soluble |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648724 |
SMD4300SNL250T5 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
Water Soluble |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648731 |
SMDLTLFP500T3C |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
- |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648734 |
TS391AX |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Syringe, 15g (0.5 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648735 |
TS391LT |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Syringe, 15g (0.5 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648742 |
SMD291SNL60T4 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 60g (2.1 oz) |
24 Months (Date of Manufacture) (Unmixed) |
Active |
| 3648755 |
SMD2200 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648759 |
TS391SNL |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Syringe, 15g (0.5 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648760 |
TS391SNL50 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 50g (1.8 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648761 |
SMD2SWLF.031 8OZ |
Chip Quik Inc. |
SMD2 |
Wire Solder |
440°F (227°C) |
Lead Free |
Sn99.3Cu0.7 (99.3/0.7) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648762 |
SMD2SWLF.020 8OZ |
Chip Quik Inc. |
SMD2 |
Wire Solder |
440°F (227°C) |
Lead Free |
Sn99.3Cu0.7 (99.3/0.7) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648763 |
TS391LT50 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 50g (1.8 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648764 |
SMD3SW.031 8OZ |
Chip Quik Inc. |
SMD3 |
Wire Solder |
354°F (179°C) |
Leaded |
Sn63Pb36Ag2 (63/36/2) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648765 |
SMD3SW.020 8OZ |
Chip Quik Inc. |
SMD3 |
Wire Solder |
354°F (179°C) |
Leaded |
Sn63Pb36Ag2 (63/36/2) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648766 |
SMD2215-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648767 |
SMD2205-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648768 |
SMD2200-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648769 |
TS391AX10 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Syringe, 35g (1.18 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648770 |
SMD2190-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648771 |
TS391LT10 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Syringe, 35g (1.18 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648772 |
TS391SNL10 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Syringe, 35g (1.18 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648773 |
SMD2165-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648774 |
SMDSWLF.031 8OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648775 |
SMDSWLF.020 8OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648780 |
SMD2060-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648781 |
SMD2055-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648782 |
SMD2050-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648783 |
SMDSWLF.015 8OZ |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean, Water Soluble |
0.015" (0.38mm) |
28 AWG, 30 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |
| 3648784 |
SMD2040-25000 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648785 |
SMD2SW.031 1LB |
Chip Quik Inc. |
SMD2 |
Wire Solder |
361 ~ 370°F (183 ~ 188°C) |
Leaded |
Sn60Pb40 (60/40) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648786 |
SMDSW.031 1LB |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648787 |
SMD2SW.020 1LB |
Chip Quik Inc. |
SMD2 |
Wire Solder |
361 ~ 370°F (183 ~ 188°C) |
Leaded |
Sn60Pb40 (60/40) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648788 |
SMDSW.020 1LB |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648789 |
SMD2SWLF.020 1LB |
Chip Quik Inc. |
SMD2 |
Wire Solder |
440°F (227°C) |
Lead Free |
Sn99.3Cu0.7 (99.3/0.7) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648794 |
SMD2SWLF.031 1LB |
Chip Quik Inc. |
SMD2 |
Wire Solder |
440°F (227°C) |
Lead Free |
Sn99.3Cu0.7 (99.3/0.7) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648795 |
SMD2SWLF.015 1LB |
Chip Quik Inc. |
SMD2 |
Wire Solder |
440°F (227°C) |
Lead Free |
Sn99.3Cu0.7 (99.3/0.7) |
No-Clean, Water Soluble |
0.015" (0.38mm) |
28 AWG, 30 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648796 |
TS391SNL250 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648797 |
SMD3SW.031 1LB |
Chip Quik Inc. |
SMD3 |
Wire Solder |
354°F (179°C) |
Leaded |
Sn63Pb36Ag2 (63/36/2) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648798 |
SMD3SW.020 1LB |
Chip Quik Inc. |
SMD3 |
Wire Solder |
354°F (179°C) |
Leaded |
Sn63Pb36Ag2 (63/36/2) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648803 |
SMD291AX500T3C |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
- |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648804 |
TS391LT250 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) |
Active |
| 3648805 |
TS391AX500C |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Cartridge, 17 oz (500g) |
12 Months (Date of Manufacture) |
Active |
| 3648806 |
SMDSWLF.031 1LB |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648807 |
SMDSWLF.020 1LB |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean, Water Soluble |
0.020" (0.51mm) |
24 AWG, 26 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648808 |
SMDSWLF.015 1LB |
Chip Quik Inc. |
- |
Wire Solder |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean, Water Soluble |
0.015" (0.38mm) |
28 AWG, 30 SWG |
0.022 |
Spool, 1 lb (454 g) |
No Shelf Life |
Active |
| 3648813 |
TS391SNL500C |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 428°F (217 ~ 220°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
No-Clean |
- |
- |
- |
Cartridge, 17 oz (500g) |
12 Months (Date of Manufacture) |
Active |
| 3648814 |
TS391LT500C |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Cartridge, 17 oz (500g) |
12 Months (Date of Manufacture) |
Active |
| 3648815 |
SMDLTLFP250T5 |
Chip Quik Inc. |
- |
Solder Paste |
281°F (138°C) |
Lead Free |
Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648820 |
SMD2205 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648822 |
SMD291AX250T3 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648825 |
SMDSW.031 2OZ |
Chip Quik Inc. |
- |
Wire Solder |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 57g (2 oz) |
No Shelf Life |
Active |
| 3648829 |
SMD4300SNL250T4 |
Chip Quik Inc. |
- |
Solder Paste |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
Water Soluble |
- |
- |
- |
Jar, 250g (9 oz) |
6 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648834 |
SMD4300AX250T4 |
Chip Quik Inc. |
- |
Solder Paste |
361°F (183°C) |
Leaded |
Sn63Pb37 (63/37) |
Water Soluble |
- |
- |
- |
Jar, 250g (9 oz) |
12 Months (Date of Manufacture) (Refrigerated) |
Active |
| 3648835 |
SMD2040 |
Chip Quik Inc. |
SMD2 |
Solder Sphere |
423 ~ 424°F (217 ~ 218°C) |
Lead Free |
Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
- |
- |
- |
- |
- |
24 Months (Date of Manufacture) |
Active |
| 3648836 |
SMD2SW.031 8OZ |
Chip Quik Inc. |
SMD2 |
Wire Solder |
361 ~ 370°F (183 ~ 188°C) |
Leaded |
Sn60Pb40 (60/40) |
No-Clean, Water Soluble |
0.031" (0.79mm) |
22 AWG, 24 SWG |
0.022 |
Spool, 8 oz (226.8 g) |
No Shelf Life |
Active |