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Артикул Производитель Серия Упаковка Тип Способ монтажа Особенности Способ присоединения Диапазон рабочих температур Колво контактов Шаг верхних контактов Покрытие верхних контактов Толщина покрытия верхних контактов Материал верхних контактов Шаг нижних контактов Покрытие нижних контактов Толщина покрытия нижних контактов Материал нижних контактов Материал корпуса Жизненный цикл
Жизненный цикл
635083 44-3551-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 44 (2 x 22) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635084 22-8850-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635085 22-8600-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635086 22-8500-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635087 22-81250-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635088 22-81250-310C Aries Electronics 8 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635089 22-81150-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635099 84-PGM13053-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635100 84-PGM11010-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635101 84-PGM11009-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635102 84-PGM10003-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635103 32-6518-01 Aries Electronics 518 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder - 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635104 24-7500-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 24 (1 x 24) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635105 24-7XXXX-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 24 (1 x 24) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635106 24-7445-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 24 (1 x 24) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635112 24-6556-11 Aries Electronics 6556 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder - 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyphenylene Sulfide (PPS),Glass Filled Active
635118 60-9513-11 Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.9" (22.86mm) RowSpacing Through Hole Closed Frame Solder - 60 (2 x 30) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635130 28-6823-90T Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder - 28 (2 x 14) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635131 34-3503-30 Aries Electronics 503 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 34 (2 x 17) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635132 34-3503-20 Aries Electronics 503 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 34 (2 x 17) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635133 24-6823-90 Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder - 24 (2 x 12) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635140 36-1508-30 Aries Electronics 508 Bulk DIP, 0.2" (5.08mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 36 (2 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon4/6 Active
635141 36-1508-20 Aries Electronics 508 Bulk DIP, 0.2" (5.08mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 36 (2 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon4/6 Active
635142 36-0508-30 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 36 (1 x 36) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635143 36-0508-20 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 36 (1 x 36) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635144 19-0503-31 Aries Electronics 0503 Bulk SIP Through Hole - Wire Wrap - 19 (1 x 19) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA), Nylon, GlassFilled Active
635145 19-0503-21 Aries Electronics 0503 Bulk SIP Through Hole - Wire Wrap - 19 (1 x 19) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA), Nylon, GlassFilled Active
635152 32-C300-00 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.6" (15.24mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635153 32-C212-00 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.6" (15.24mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635154 32-C182-00 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.6" (15.24mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635160 81-PGM09001-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635161 23-7XXXX-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 23 (1 x 23) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635162 23-7400-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 23 (1 x 23) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635171 80-PGM12015-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635182 32-820-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635184 34-0501-20 Aries Electronics 501 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 34 (1 x 34) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635191 42-6556-10 Aries Electronics 6556 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyphenylene Sulfide (PPS),Glass Filled Active
635192 24-6556-30 Aries Electronics 6556 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Wire Wrap - 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyphenylene Sulfide (PPS),Glass Filled Active
635193 24-6556-20 Aries Electronics 6556 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Wire Wrap - 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyphenylene Sulfide (PPS),Glass Filled Active
635204 16-6621-30 Aries Electronics 6621 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Bottom Entry;Through Board Closed Frame Solder -55°C ~105°C 16 (2 x 8) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635205 19-0501-31 Aries Electronics 501 Bulk SIP Through Hole - Wire Wrap -55°C ~125°C 19 (1 x 19) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635206 19-0501-21 Aries Electronics 501 Bulk SIP Through Hole - Wire Wrap -55°C ~125°C 19 (1 x 19) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635207 11-0511-11 Aries Electronics 511 Bulk SIP Through Hole - Solder -55°C ~125°C 11 (1 x 11) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635208 30-6511-11 Aries Electronics 511 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 30 (2 x 15) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635212 14-C280-31 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.3" (7.62mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635213 14-C280-21 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.3" (7.62mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635214 14-C195-31 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635215 14-C195-21 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635216 50-9518-10M Aries Electronics 518 Bulk DIP, 0.9" (22.86mm) RowSpacing Through Hole Open Frame Solder - 50 (2 x 25) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635217 50-9513-11 Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.9" (22.86mm) RowSpacing Through Hole Closed Frame Solder - 50 (2 x 25) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635227 34-6511-11 Aries Electronics 511 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 34 (2 x 17) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635230 30-3513-11H Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Solder - 30 (2 x 15) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635239 16-820-90CTL Aries Electronics Vertisockets™800 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 16 (2 x 8) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635246 35-0508-30 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 35 (1 x 35) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635247 35-0508-20 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 35 (1 x 35) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635248 22-7XXXX-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 22 (1 x 22) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635249 22-7400-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 22 (1 x 22) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635262 42-6553-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635263 42-6552-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635264 42-6551-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635265 42-3553-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635266 42-3552-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635267 42-3551-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 42 (2 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635268 28-822-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635269 28-820-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635270 28-6823-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635271 28-6822-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635272 28-6820-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635273 28-6508-301 Aries Electronics 508 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635274 28-6508-201 Aries Electronics 508 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635275 28-3508-301 Aries Electronics 508 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635276 28-3508-201 Aries Electronics 508 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~105°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635277 40-9513-10H Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.9" (22.86mm) RowSpacing Through Hole Closed Frame Solder - 40 (2 x 20) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635278 22-6501-31 Aries Electronics 501 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 22 (2 x 11) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635279 22-6501-21 Aries Electronics 501 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 22 (2 x 11) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635282 36-6553-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder - 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635283 36-6552-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder - 36 (2 x 18) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635284 36-6551-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder - 36 (2 x 18) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635285 36-3553-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 36 (2 x 18) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635286 36-3551-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 36 (2 x 18) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635288 18-1508-31 Aries Electronics 508 Bulk DIP, 0.2" (5.08mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 18 (2 x 9) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635289 18-1508-21 Aries Electronics 508 Bulk DIP, 0.2" (5.08mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 18 (2 x 9) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635292 40-3513-11H Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Solder - 40 (2 x 20) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635298 36-6556-10 Aries Electronics 6556 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder - 36 (2 x 18) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyphenylene Sulfide (PPS),Glass Filled Active
635303 18-0508-31 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~125°C 18 (1 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635304 18-0508-21 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~125°C 18 (1 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635310 32-3513-11H Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Solder - 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635316 20-6810-90T Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Vertical Closed Frame Solder - 20 (2 x 10) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635321 28-6501-31 Aries Electronics 501 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635322 28-6501-21 Aries Electronics 501 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635330 32-3554-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 32 (2 x 16) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635334 18-0501-31 Aries Electronics 501 Bulk SIP Through Hole - Wire Wrap -55°C ~125°C 18 (1 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635335 18-0501-21 Aries Electronics 501 Bulk SIP Through Hole - Wire Wrap -55°C ~125°C 18 (1 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635355 26-6823-90T Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder - 26 (2 x 13) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635356 22-6823-90 Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder - 22 (2 x 11) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635357 21-7XXXX-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 21 (1 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635358 21-7562-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 21 (1 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635359 21-7530-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 21 (1 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635360 21-7438-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 21 (1 x 21) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635362 32-6511-11 Aries Electronics 511 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active

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