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Артикул Производитель Серия Упаковка Тип Способ монтажа Особенности Способ присоединения Диапазон рабочих температур Колво контактов Шаг верхних контактов Покрытие верхних контактов Толщина покрытия верхних контактов Материал верхних контактов Шаг нижних контактов Покрытие нижних контактов Толщина покрытия нижних контактов Материал нижних контактов Материал корпуса Жизненный цикл
Жизненный цикл
635299 232-1297-00-3303 3M OEM Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Through Hole Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 250µin(6.35µm) Beryllium Copper 0.100" (2.54mm) Gold 250µin(6.35µm) Beryllium Copper Polyether Imide (PEI), GlassFilled Active
635315 232-1271-00-1102JH 3M OEM - - - - - - - - - - - - - - - - Active
636561 216-6278-00-3303 3M OEM Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder -55°C ~105°C 16 (2 x 8) 0.100" (2.54mm) Gold 250µin(6.35µm) Beryllium Copper 0.100" (2.54mm) Gold 250µin(6.35µm) Beryllium Copper Polyether Imide (PEI), GlassFilled Active
636682 200-6325-9UN-1900 3M Textool™ Bulk PGA, ZIF (ZIP) Through Hole - Solder -55°C ~150°C 625 (25 x 25) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polyethersulfone (PES) Active
636683 248-5205-01 3M Textool™ Bulk QFN Through Hole Closed Frame Solder - 48 (4 x 12) 0.020" (0.50mm) Gold - Beryllium Copper - Gold - Beryllium Copper Polyethersulfone (PES) Active
636684 248-1282-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 48 (2 x 24) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636761 8484-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 84 (4 x 21) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636770 8468-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 68 (4 x 17) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636773 8468-21B1-RK-TP 3M 8400 Tube PLCC Surface Mount Closed Frame Solder -40°C ~105°C 68 (4 x 17) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636782 8452-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 52 (4 x 13) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636792 8444-21A1-RK-TP 3M 8400 Tube PLCC Surface Mount Closed Frame Solder -40°C ~105°C 44 (4 x 11) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636794 8444-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 44 (4 x 11) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636802 8432-21B1-RK-TP 3M 8400 Tube PLCC Surface Mount Closed Frame Solder -40°C ~105°C 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636804 8428-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 28 (4 x 7) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636809 8420-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 20 (4 x 5) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636820 4840-6004-CP 3M 4800 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 40 (2 x 20) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636822 4840-6000-CP 3M 4800 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 40 (2 x 20) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636824 4828-6004-CP 3M 4800 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 28 (2 x 14) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636825 4824-6000-CP 3M 4800 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 24 (2 x 12) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636826 4824-3000-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 24 (2 x 12) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636827 4828-6000-CP 3M 4800 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 28 (2 x 14) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636829 4832-6000-CP 3M 4800 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 32 (2 x 16) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636835 4820-3004-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 20 (2 x 10) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636837 4820-3000-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 20 (2 x 10) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636838 4818-3004-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 18 (2 x 9) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636841 4816-3004-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 16 (2 x 8) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636849 4814-3004-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 14 (2 x 7) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636850 4808-3004-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 8 (2 x 4) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636851 4814-3000-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 14 (2 x 7) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636852 4808-3000-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 8 (2 x 4) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
636887 264-5205-01 3M Textool™ Bulk QFN Through Hole Open Frame Solder - 64 (4 x 16) 0.020" (0.50mm) Gold - Beryllium Copper 0.020" (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES) Active
636888 200-6315-9UN-1900 3M Textool™ Bulk PGA, ZIF (ZIP) Through Hole - Solder -55°C ~150°C 225 (15 x 15) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polyethersulfone (PES) Active
636890 200-6313-9UN-1900 3M Textool™ Bulk PGA, ZIF (ZIP) Through Hole - Solder -55°C ~150°C 169 (13 x 13) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polyethersulfone (PES) Active
636892 220-2600-00-0602 3M Textool™ Bulk SIP, ZIF (ZIP) Through Hole - Solder -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636893 203-2737-55-1102 3M Textool™ Bulk Transistor, TO-3 and TO-66 Through Hole Closed Frame Solder -55°C ~150°C 3 (Rectangular) - Gold 30µin(0.76µm) Beryllium Copper 0.234" (5.94mm) Gold 30µin(0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
636896 216-7383-55-1902 3M Textool™ Bulk SOIC Through Hole Closed Frame Solder -55°C ~150°C 16 (2 x 8) - Gold - Beryllium Copper - Gold 30µin(0.76µm) Beryllium Copper Polyethersulfone (PES), GlassFilled Active
636897 216-7224-55-1902 3M Textool™ Bulk SOIC Through Hole Closed Frame Solder -55°C ~150°C 16 (2 x 8) - Gold - Beryllium Copper - Gold 30µin(0.76µm) Beryllium Copper Polyethersulfone (PES), GlassFilled Active
636898 214-7390-55-1902 3M Textool™ Bulk SOIC Through Hole Closed Frame Solder -55°C ~150°C 14 (2 x 7) - Gold - Beryllium Copper - Gold 30µin(0.76µm) Beryllium Copper Polyethersulfone (PES), GlassFilled Active
636899 224-1286-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636900 240-1280-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636902 218-3341-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 18 (2 x 9) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636903 228-1277-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636904 216-3340-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636905 224-1275-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.6" (15.24mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636906 220-3342-00-0602J 3M Textool™ Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Connector Closed Frame Press-Fit -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
636976 8444-21B1-RK-TP 3M 8400 Tube PLCC Surface Mount Closed Frame Solder -40°C ~105°C 44 (4 x 11) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636982 8432-11B1-RK-TP 3M 8400 Tube PLCC Through Hole Closed Frame Solder -40°C ~105°C 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636983 8444-21B1-RK-TR 3M 8400 Tape & Reel(TR) Alternate Packaging PLCC Surface Mount Closed Frame Solder -40°C ~105°C 44 (4 x 11) 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy 0.050" (1.27mm) Tin 160µin(4.06µm) Copper Alloy Polybutylene Terephthalate(PBT), Glass Filled Active
636999 4828-3004-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 28 (2 x 14) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
637007 4816-3000-CP 3M 4800 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -25°C ~85°C 16 (2 x 8) 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze 0.100" (2.54mm) Tin 35µin(0.90µm) Phosphor Bronze Polyester, Glass Filled Active
638585 251-5949-51-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638588 251-5949-52-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638633 235-3019-02-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638634 235-3019-01-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638647 235-3019-52-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638648 235-3019-51-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638662 234-3034-02-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 34 (2 x 17) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638663 234-3034-01-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 34 (1 x 34) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638674 234-3034-52-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 34 (2 x 17) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638676 234-3034-51-0602 3M Textool™ Bulk Zig-Zag, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 34 (2 x 17) 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper 0.050" (1.27mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638849 236-6225-50-0602 3M - - - - - - - - - - - - - - - - - Active
638894 239-5605-02-0602 3M - Bulk Zig-Zag Through Hole Closed Frame Solder -55°C ~150°C 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638908 232-2601-50-0602 3M - - - - - - - - - - - - - - - - - Active
638909 239-5605-01-0602 3M - Bulk Zig-Zag Through Hole Closed Frame Solder -55°C ~150°C 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638969 239-5605-52-0602 3M - - - - - - - - - - - - - - - - - Active
638972 232-1270-51-0602 3M Textool™ - - - - - - - - - - - - - - - - Active
638973 232-1270-52-0602 3M Textool™ - - - - - - - - - - - - - - - - Active
638976 232-1270-02-0602 3M Textool™ Bulk PGA, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638977 232-1270-01-0602 3M Textool™ Bulk PGA, ZIF (ZIP) Through Hole Closed Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polysulfone (PSU), GlassFilled Active
638978 239-5605-51-0602 3M - - - - - - - - - - - - - - - - - Active
639050 CUSTOM BGA 3M Textool™ - BGA Through Hole Custom - - Custom 0.026" ~ 0.050" (0.65mm ~1.27mm) Custom Custom - - - - - - Active
639684 249-930X-XX-2401 3M Textool™ - BGA Through Hole Closed Frame - - 49 (Verification Required) 0.039" (1.00mm) Gold - - - - - - - Obsolete
639747 500-032-050 3M - - SIP Through Hole Closed Frame - - 32 (1 x 32) 0.100" (2.54mm) Gold 8µin(0.20µm) - 0.100" (2.54mm) Gold 8µin(0.20µm) - - Obsolete
639748 400-040-050 3M 400 - DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame - - 40 (2 x 20) 0.100" (2.54mm) Gold 8µin(0.20µm) - 0.100" (2.54mm) Gold 8µin(0.20µm) - - Obsolete
639749 400-032-050 3M 400 - DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame - - 32 (2 x 16) 0.100" (2.54mm) Gold 8µin(0.20µm) - 0.100" (2.54mm) Gold 8µin(0.20µm) - - Obsolete
639750 400-028-050 3M 400 - DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame - - 28 (2 x 14) 0.100" (2.54mm) Gold 8µin(0.20µm) - 0.100" (2.54mm) Gold 8µin(0.20µm) - - Obsolete
639751 300-032-050 3M 300 - SIP Through Hole Closed Frame - - 32 (1 x 32) 0.100" (2.54mm) Gold 8µin(0.20µm) - 0.100" (2.54mm) Gold 8µin(0.20µm) - - Obsolete
639752 130-028-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639753 130-024-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639754 110-024-050 3M 100 Bulk DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639755 100-048-050 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 48 (2 x 24) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639756 100-042-050 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 42 (2 x 21) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639757 100-040-051 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639758 100-040-050 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639759 100-032-051 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639760 100-028-051 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639761 100-032-050 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639762 100-028-050 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639763 100-024-051 3M 100 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639764 100-022-050 3M 100 Bulk DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 22 (2 x 11) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639765 100-020-051 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639766 100-020-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639767 100-018-051 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 18 (2 x 9) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639768 100-018-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 18 (2 x 9) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639769 100-016-051 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639770 100-016-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639771 100-014-051 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639772 100-014-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639773 100-010-050 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -65°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete
639774 100-008-051 3M 100 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Seal Tape Solder -65°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 8µin(0.20µm) Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS),Glass Filled Obsolete

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