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Manufacturer Part Number Manufacturer Series Packaging Type Mounting Type Features Termination Operating Temperature Number of Positions or Pins Grid Pitch Mating Contact Finish Mating Contact Finish Thickness Mating Contact Material Mating Pitch Post Contact Finish Post Contact Finish Thickness Post Contact Material Post Housing Material Lifecycle
Lifecycle
635083 44-3551-10 Aries Electronics 55 Bulk DIP, ZIF (ZIP), 0.3" (7.62mm)Row Spacing Through Hole Closed Frame Solder - 44 (2 x 22) 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS),Glass Filled Active
635084 22-8850-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635085 22-8600-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635086 22-8500-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635087 22-81250-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635088 22-81250-310C Aries Electronics 8 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635089 22-81150-610C Aries Electronics 8 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame, Elevated Solder -55°C ~105°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635090 210227-4 TE Connectivity AMPConnectors - Bulk PGA Through Hole Open Frame Press-Fit - 169 (17 x 17) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 197µin(5.00µm) Phosphor Bronze Thermoplastic, Polyester,Glass Filled Active
635091 210-99-640-41-001000 Mill-Max Manufacturing Corp. 210 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100µin(2.54µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635092 126-93-308-41-001000 Mill-Max Manufacturing Corp. 126 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635093 714-43-258-31-018000 Mill-Max Manufacturing Corp. 714 Bulk DIP, 0.1" (2.54mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 58 (2 x 29) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635094 714-43-158-31-018000 Mill-Max Manufacturing Corp. 714 Bulk SIP Through Hole - Solder -55°C ~125°C 58 (1 x 58) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635095 127-93-316-41-002000 Mill-Max Manufacturing Corp. 127 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~125°C 16 (2 x 8) 0.070" (1.78mm) Gold 30µin(0.76µm) Beryllium Copper 0.070" (1.78mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635096 510-83-179-18-113101 Preci-Dip 510 Bulk PGA Through Hole Open Frame Solder -55°C ~125°C 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635097 510-83-179-18-112101 Preci-Dip 510 Bulk PGA Through Hole Open Frame Solder -55°C ~125°C 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635098 510-83-179-18-001101 Preci-Dip 510 Bulk PGA Through Hole Open Frame Solder -55°C ~125°C 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635099 84-PGM13053-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635100 84-PGM11010-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635101 84-PGM11009-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635102 84-PGM10003-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635103 32-6518-01 Aries Electronics 518 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder - 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635104 24-7500-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 24 (1 x 24) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635105 24-7XXXX-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 24 (1 x 24) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635106 24-7445-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 24 (1 x 24) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635107 101-93-306-41-560000 Mill-Max Manufacturing Corp. 101 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 6 (2 x 3) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635108 114-93-632-41-117000 Mill-Max Manufacturing Corp. 114 Tube DIP, 0.6" (15.24mm) RowSpacing Surface Mount Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635109 114-93-432-41-117000 Mill-Max Manufacturing Corp. 114 Tube DIP, 0.4" (10.16mm) RowSpacing Surface Mount Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635110 116-93-420-41-008000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635111 116-93-320-41-008000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635112 24-6556-11 Aries Electronics 6556 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder - 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyphenylene Sulfide (PPS),Glass Filled Active
635113 614-87-101-13-061112 Preci-Dip 614 Bulk PGA Through Hole Open Frame Solder -55°C ~125°C 101 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635114 104-13-420-41-770000 Mill-Max Manufacturing Corp. 104 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Press-Fit - 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Alloy Thermoplastic Active
635115 116-93-308-41-001000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635116 110-13-316-10-003000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635117 101-93-628-41-560000 Mill-Max Manufacturing Corp. 101 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635118 60-9513-11 Aries Electronics Lo-PRO®file,513 Bulk DIP, 0.9" (22.86mm) RowSpacing Through Hole Closed Frame Solder - 60 (2 x 30) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635119 110-91-952-41-001000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.9" (22.86mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 52 (2 x 26) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635120 116-93-624-41-006000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635121 116-93-324-41-006000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635122 116-93-316-41-001000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635123 110-13-314-10-002000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 14 (2 x 7), 8 Loaded 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635124 115-93-636-41-001000 Mill-Max Manufacturing Corp. 115 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 36 (2 x 18) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635125 116-83-652-41-013101 Preci-Dip 116 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635126 110-93-428-41-105000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.4" (10.16mm) RowSpacing Surface Mount Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635127 110-93-328-41-105000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.3" (7.62mm) RowSpacing Surface Mount Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635128 210-93-320-41-001000 Mill-Max Manufacturing Corp. 210 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635129 104-13-316-41-780000 Mill-Max Manufacturing Corp. 104 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Press-Fit - 16 (2 x 8) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Alloy Thermoplastic Active
635130 28-6823-90T Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder - 28 (2 x 14) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635131 34-3503-30 Aries Electronics 503 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 34 (2 x 17) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635132 34-3503-20 Aries Electronics 503 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 34 (2 x 17) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635133 24-6823-90 Aries Electronics Vertisockets™800 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder - 24 (2 x 12) 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10µin(0.25µm) Phosphor Bronze Polyamide (PA46), Nylon4/6 Active
635134 126-93-306-41-001000 Mill-Max Manufacturing Corp. 126 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~125°C 6 (2 x 3) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635135 115-93-636-41-003000 Mill-Max Manufacturing Corp. 115 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 36 (2 x 18) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635136 116-93-422-41-003000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635137 116-93-322-41-003000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 22 (2 x 11) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635138 116-93-310-41-003000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635139 116-93-210-41-003000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.2" (5.08mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635140 36-1508-30 Aries Electronics 508 Bulk DIP, 0.2" (5.08mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 36 (2 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon4/6 Active
635141 36-1508-20 Aries Electronics 508 Bulk DIP, 0.2" (5.08mm) RowSpacing Through Hole Closed Frame Wire Wrap -55°C ~105°C 36 (2 x 18) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon4/6 Active
635142 36-0508-30 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 36 (1 x 36) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635143 36-0508-20 Aries Electronics 508 Bulk SIP Through Hole - Wire Wrap -55°C ~105°C 36 (1 x 36) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper - Gold 10µin(0.25µm) Brass Polyamide (PA46), Nylon4/6 Active
635144 19-0503-31 Aries Electronics 0503 Bulk SIP Through Hole - Wire Wrap - 19 (1 x 19) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA), Nylon, GlassFilled Active
635145 19-0503-21 Aries Electronics 0503 Bulk SIP Through Hole - Wire Wrap - 19 (1 x 19) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polyamide (PA), Nylon, GlassFilled Active
635146 110-99-642-41-001000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635147 510-83-192-16-001101 Preci-Dip 510 Bulk PGA Through Hole Open Frame Solder -55°C ~125°C 192 (16 x 16) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635148 114-93-314-41-117000 Mill-Max Manufacturing Corp. 114 Tube DIP, 0.3" (7.62mm) RowSpacing Surface Mount Open Frame Solder -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635149 110-93-310-41-105000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.3" (7.62mm) RowSpacing Surface Mount Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635150 110-93-210-41-105000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.2" (5.08mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635151 614-87-100-13-062112 Preci-Dip 614 Bulk PGA Through Hole Open Frame Solder -55°C ~125°C 100 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Tin - Brass PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester, Glass Filled Active
635152 32-C300-00 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.6" (15.24mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635153 32-C212-00 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.6" (15.24mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635154 32-C182-00 Aries Electronics EJECT-A-DIP™ Bulk DIP, 0.6" (15.24mm) RowSpacing Surface Mount Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635155 101-93-308-41-560000 Mill-Max Manufacturing Corp. 101 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635156 612-93-420-41-001000 Mill-Max Manufacturing Corp. 612 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635157 612-93-320-41-001000 Mill-Max Manufacturing Corp. 612 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635158 123-93-420-41-001000 Mill-Max Manufacturing Corp. 123 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635159 714-43-157-31-018000 Mill-Max Manufacturing Corp. 714 Bulk SIP Through Hole - Solder -55°C ~125°C 57 (1 x 57) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635160 81-PGM09001-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635161 23-7XXXX-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 23 (1 x 23) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635162 23-7400-10 Aries Electronics 700 ElevatorStrip-Line™ Bulk SIP Through Hole Elevated Solder -55°C ~105°C 23 (1 x 23) 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze 0.100" (2.54mm) Tin 200µin(5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6,Glass Filled Active
635163 104-13-308-41-780000 Mill-Max Manufacturing Corp. 104 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Press-Fit - 8 (2 x 4) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Alloy Thermoplastic Active
635164 614-93-310-31-018000 Mill-Max Manufacturing Corp. 614 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635165 116-93-420-41-007000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635166 116-93-320-41-007000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635167 110-13-210-41-001000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.2" (5.08mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635168 210-99-964-41-001000 Mill-Max Manufacturing Corp. 210 Tube DIP, 0.9" (22.86mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 64 (2 x 32) 0.100" (2.54mm) Tin-Lead 100µin(2.54µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635169 110-91-950-41-001000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.9" (22.86mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 50 (2 x 25) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635170 110-93-632-41-605000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635171 80-PGM12015-10 Aries Electronics PGM Bulk PGA Through Hole - Solder -55°C ~105°C - 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active
635172 614-93-624-31-018000 Mill-Max Manufacturing Corp. 614 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635173 614-93-424-31-018000 Mill-Max Manufacturing Corp. 614 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635174 126-93-314-41-001000 Mill-Max Manufacturing Corp. 126 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635175 110-91-428-41-001000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.4" (10.16mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635176 110-99-636-41-001000 Mill-Max Manufacturing Corp. 110 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 36 (2 x 18) 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635177 116-93-310-41-006000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635178 116-93-210-41-006000 Mill-Max Manufacturing Corp. 116 Tube DIP, 0.2" (5.08mm) RowSpacing Through Hole Elevated, Open Frame Solder -55°C ~125°C 10 (2 x 5) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635179 210-99-632-41-001000 Mill-Max Manufacturing Corp. 210 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100µin(2.54µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200µin(5.08µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635180 210-13-624-41-001000 Mill-Max Manufacturing Corp. 210 Tube DIP, 0.6" (15.24mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635181 210-13-324-41-001000 Mill-Max Manufacturing Corp. 210 Tube DIP, 0.3" (7.62mm) RowSpacing Through Hole Closed Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Alloy PolycyclohexylenedimethyleneTerephthalate (PCT), Polyester Active
635182 32-820-90C Aries Electronics Vertisockets™800 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole, Right Angle,Horizontal Closed Frame Solder -55°C ~105°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200µin(5.08µm) Brass Polyamide (PA46), Nylon 4/6,Glass Filled Active

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