| Артикул | Производитель | Серия | Упаковка | Емкость | Допуск | Напряжение пробоя | Эквивалентное посллед.сопр. | Эквивалентная послед.индуктивность | Области применения | Особенности | Диапазон рабочих температур | Типоразмер | Высота | Габаритные размеры | Жизненный цикл | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Жизненный цикл | ||||||||||||||||
| 2267324 | 905R0K | M/A-Com Technology Solutions | 90 | Tray - Waffle | 5pF | ±10% | 50V | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.007" (0.18mm) | 0.010" L x 0.010" W (0.25mm x 0.25mm) | Active |
| 2267325 | 9122RK | M/A-Com Technology Solutions | 91 | Tray - Waffle | 22pF | ±10% | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.006" (0.15mm) | 0.020" L x 0.020" W (0.51mm x 0.51mm) | Active |
| 2267326 | 9047RK | M/A-Com Technology Solutions | 90 | Tray - Waffle | 47pF | ±10% | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.006" (0.15mm) | 0.020" L x 0.020" W (0.51mm x 0.51mm) | Active |
| 2267327 | 9123RK | M/A-Com Technology Solutions | 91 | Tray - Waffle | 23pF | ±10% | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.006" (0.15mm) | 0.020" L x 0.020" W (0.51mm x 0.51mm) | Active |
| 2267328 | 9115R0K-BOO | M/A-Com Technology Solutions | - | Tray | 15pF | - | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | - | 0.020" L x 0.020" W (0.51mm x 0.51mm) | Active |
| 2267329 | 919R9K | M/A-Com Technology Solutions | 91 | Tray - Waffle | 9.9pF | ±10% | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.005" (0.13mm) | 0.015" L x 0.015" W (0.38mm x 0.38mm) | Active |
| 2267330 | 9112RK | M/A-Com Technology Solutions | 91 | Tray - Waffle | 12pF | ±10% | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.006" (0.15mm) | 0.020" L x 0.020" W (0.51mm x 0.51mm) | Active |
| 2267331 | 90100RK | M/A-Com Technology Solutions | 90 | Tray - Waffle | 100pF | ±10% | 50V | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.010" (0.25mm) | 0.040" L x 0.040" W (1.02mm x 1.02mm) | Active |
| 2267332 | 906R0M-14-2 | M/A-Com Technology Solutions | 90 | Tray - Waffle | 6pF | ±20% | - | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.005" (0.13mm) | 0.010" L x 0.010" W (0.25mm x 0.25mm) | Active |
| 2267343 | 9010RK | M/A-Com Technology Solutions | 90 | Tray - Waffle | 10pF | ±10% | 50V | - | - | High Stability | High Reliability | -55°C ~ 150°C | Nonstandard Chip | 0.007" (0.18mm) | 0.010" L x 0.010" W (0.25mm x 0.25mm) | Active |
