Components

	Manufacturer Part Number	Manufacturer	Series	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size Dimension	Lifecycle
											Lifecycle
3477256	319010042	Seeed Technology Ltd.	-	SMD to Plated Through Hole Board	SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP	6, 8	0.020" (0.50mm)	-	-	3.937" L x 3.150" W (100.00mm x 80.00mm)	Obsolete
3477257	319010045	Seeed Technology Ltd.	-	SMD to Plated Through Hole Board	QFP	80	0.026" (0.65mm)	-	-	1.575" L x 1.575" W (40.00mm x 40.00mm)	Obsolete
3477502	319010352	Seeed Technology Ltd.	-	SMD to Plated Through Hole Board	QFP	80	0.020" (0.50mm)	-	-	1.575" L x 1.575" W (40.00mm x 40.00mm)	Active
3477503	319010351	Seeed Technology Ltd.	-	SMD to Plated Through Hole Board	QFP	80	0.031" (0.80mm)	-	-	1.575" L x 1.575" W (40.00mm x 40.00mm)	Active
3477526	319010047	Seeed Technology Ltd.	-	SMD to Plated Through Hole Board	SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP	6, 8	0.020" (0.50mm)	-	-	3.937" L x 3.150" W (100.00mm x 80.00mm)	Active
3477629	319010053	Seeed Technology Ltd.	-	SMD to Plated Through Hole Board	SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP	6, 8	0.026" (0.65mm)	-	-	3.937" L x 3.150" W (100.00mm x 80.00mm)	Active

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