Артикул | Производитель | Серия | Тип макетной платы | Совместимый тип корпуса | Кол-во положений | Шаг | Толщина платы | Материал | Габаритные размеры | Жизненный цикл | |
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Жизненный цикл | |||||||||||
3477256 | 319010042 | Seeed Technology Ltd. | - | SMD to Plated Through Hole Board | SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP | 6, 8 | 0.020" (0.50mm) | - | - | 3.937" L x 3.150" W (100.00mm x 80.00mm) | Obsolete |
3477257 | 319010045 | Seeed Technology Ltd. | - | SMD to Plated Through Hole Board | QFP | 80 | 0.026" (0.65mm) | - | - | 1.575" L x 1.575" W (40.00mm x 40.00mm) | Obsolete |
3477502 | 319010352 | Seeed Technology Ltd. | - | SMD to Plated Through Hole Board | QFP | 80 | 0.020" (0.50mm) | - | - | 1.575" L x 1.575" W (40.00mm x 40.00mm) | Active |
3477503 | 319010351 | Seeed Technology Ltd. | - | SMD to Plated Through Hole Board | QFP | 80 | 0.031" (0.80mm) | - | - | 1.575" L x 1.575" W (40.00mm x 40.00mm) | Active |
3477526 | 319010047 | Seeed Technology Ltd. | - | SMD to Plated Through Hole Board | SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP | 6, 8 | 0.020" (0.50mm) | - | - | 3.937" L x 3.150" W (100.00mm x 80.00mm) | Active |
3477629 | 319010053 | Seeed Technology Ltd. | - | SMD to Plated Through Hole Board | SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP | 6, 8 | 0.026" (0.65mm) | - | - | 3.937" L x 3.150" W (100.00mm x 80.00mm) | Active |