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Components
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Соединители / Гнезда для микросхем и транзисторов / Гнёзда для микросхем и транзисторов
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Manufacturer Part Number |
Manufacturer |
Series |
Packaging |
Type |
Mounting Type |
Features |
Termination |
Operating Temperature |
Number of Positions or Pins Grid |
Pitch Mating |
Contact Finish Mating |
Contact Finish Thickness Mating |
Contact Material Mating |
Pitch Post |
Contact Finish Post |
Contact Finish Thickness Post |
Contact Material Post |
Housing Material |
Lifecycle |
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Lifecycle |
| 644990 |
0804MC |
Texas Instruments |
- |
Bulk |
Transistor, TO-3 |
Through Hole |
Closed Frame |
Solder |
-55°C ~150°C |
8 (Oval) |
- |
Gold |
30µin(0.76µm) |
Beryllium Copper |
- |
Tin |
200µin(5.08µm) |
Brass |
Polyester, Glass Filled |
Active |
