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Артикул Производитель Серия Упаковка Тип Способ монтажа Особенности Способ присоединения Диапазон рабочих температур Колво контактов Шаг верхних контактов Покрытие верхних контактов Толщина покрытия верхних контактов Материал верхних контактов Шаг нижних контактов Покрытие нижних контактов Толщина покрытия нижних контактов Материал нижних контактов Материал корпуса Жизненный цикл
Жизненный цикл
635552 XR2A2201N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.4" (10.16mm) RowSpacing Threaded Open Frame Solder -55°C ~125°C 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
635578 XR2A-2025 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
635597 XR2A-2001-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
635725 XR2A-2401-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
635820 XR2A-2811-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
635850 XR2C-2005 Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
635881 XR2A-3211-NZ Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 25µin(0.63µm) Beryllium Copper 0.100" (2.54mm) Gold 25µin(0.63µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
636474 XR2A-2815 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637012 XR2A-1411-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637123 XR2C-1611-N Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 16 (1 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637415 XR2A-0825 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637480 XR2C1011N Omron Electronics Inc-EMC Div XR2 Bulk SIP Threaded - Solder -55°C ~125°C 10 (1 x 10) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
637494 XR2A0815 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Threaded Open Frame Solder -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
637541 XR2A-4011-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637577 XR2A3221N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Threaded Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
637604 XR2P2041 Omron Electronics Inc-EMC Div XR2 Bulk SIP Threaded - Solder -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
637633 XR2A-3201-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637718 XR2C-3205 Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 32 (1 x 32) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637757 XR2C-2002 Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Wire Wrap -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637855 XR2C3215 Omron Electronics Inc-EMC Div XR2 Bulk SIP Threaded - Solder -55°C ~125°C 32 (1 x 32) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
637943 XR2A-2801-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 28 (2 x 14) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637978 XR2A-3211-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 32 (2 x 16) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
637985 XR2T-2021-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame, Seal Tape Solder -55°C ~125°C 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
639062 XR2E-3201-N Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Carrier Solder -55°C ~125°C 32 (1 x 32) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Obsolete
639063 XR2D-4001-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Carrier Solder -55°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Obsolete
639064 XR2D-2401-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Carrier Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Obsolete
639065 XR2E-3205 Omron Electronics Inc-EMC Div XR2 Bulk SIP - - Solder -55°C ~125°C 32 (1 x 32) 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold - Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Obsolete
639738 XR2E-3204 Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 32 (1 x 32) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Obsolete
640433 XR2A-4001-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 40 (2 x 20) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
640448 XR2T2411N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.4" (10.16mm) RowSpacing Threaded Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
640449 XR2T2401N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.4" (10.16mm) RowSpacing Threaded Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
640542 XR2T2421N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.4" (10.16mm) RowSpacing Threaded Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate(PBT), Glass Filled Active
641014 XR2C-0311-N Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 3 (1 x 3) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641044 XR2C-3200-HSG Omron Electronics Inc-EMC Div XR2 Bulk Housing Through Hole Closed Frame Wire Wrap -55°C ~125°C 32 (1 x 32) 0.100" (2.54mm) - - Beryllium Copper 0.100" (2.54mm) - - Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641061 XR2C-2000-HSG Omron Electronics Inc-EMC Div XR2 Bulk Housing - Closed Frame Solder -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) - - Beryllium Copper 0.100" (2.54mm) - - Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641230 XR2A-1425 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641232 XR2P1041 Omron Electronics Inc-EMC Div XR2 Bulk SIP Threaded - Solder -55°C ~125°C 10 (1 x 10) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
641280 XR2H-1611-N Omron Electronics Inc-EMC Div XR2 Bulk Zig-Zag Through Hole Closed Frame Solder -55°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641364 XR2A-1801-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 18 (2 x 9) 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30µin(0.76µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641457 XR2C-1511-N Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 15 (1 x 15) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641459 XR2C-2011-N Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
641597 XR2C-1501-N Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 15 (1 x 15) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
642307 XR2C-2015 Omron Electronics Inc-EMC Div XR2 Bulk SIP Through Hole Closed Frame Solder -55°C ~125°C 20 (1 x 20) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
642487 XR2T-1621-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame, Seal Tape Solder -55°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
642512 XR2A-1625 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
642554 XR2C2611N Omron Electronics Inc-EMC Div XR2 Bulk SIP Threaded - Solder -55°C ~125°C 26 (1 x 26) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Brass Polybutylene Terephthalate(PBT), Glass Filled Active
643065 XR2A-0811-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
643416 XR3G-6401 Omron Electronics Inc-EMC Div - - - - - - - - - - - - - - - - - Active
644834 XR2A-2411-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.6" (15.24mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 24 (2 x 12) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
644927 XR2A-0802 Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Wire Wrap -55°C ~125°C 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
644952 XR2A-1401-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper 0.100" (2.54mm) Gold 29.5µin(0.75µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
644956 XR2A-1611-N Omron Electronics Inc-EMC Div XR2 Bulk DIP, 0.3" (7.62mm) RowSpacing Through Hole Open Frame Solder -55°C ~125°C 16 (2 x 8) 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper 0.100" (2.54mm) Gold 10µin(0.25µm) Beryllium Copper Polybutylene Terephthalate(PBT), Glass Filled Active
27234232 XR2A-6411-N Omron Electronics Inc-EMC Div * - - - - - - - - - - - - - - Active
27234385 XR2A-1601-N Omron Electronics Inc-EMC Div * - - - - - - - - - - - - - - Active
27234407 XR2A-2471-N Omron Electronics Inc-EMC Div * - - - - - - - - - - - - - - Active

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