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Артикул Производитель Серия Вход Выход Способ монтажа Способ присоединения Колво контактов Шаг верхних контактов Покрытие верхних контактов Шаг нижних контактов Покрытие нижних контактов Материал корпуса Материал платы Жизненный цикл
Жизненный цикл
569767 PA-TS1D6SM18-56 Logical Systems Inc. - - - - - - - - - - - - Active
569781 PA-SOD6SM18-44 Logical Systems Inc. - - - - - - - - - - - - Active
569789 PA-TS1D6SM18-40 Logical Systems Inc. - - - - - - - - - - - - Active
569790 PA-SOD6SM18-40 Logical Systems Inc. - - - - - - - - - - - - Active
569935 PA44QL8-1D Logical Systems Inc. - - - - - - - - - - - -
569936 PA-SSD6SM18-40 Logical Systems Inc. - - - - - - - - - - - -
569937 PA-SOD6SM18-32 Logical Systems Inc. - - - - - - - - - - - -
569938 PA-SSD6SM18-32 Logical Systems Inc. - - - - - - - - - - - -
569939 PA-TS1D6SM18-32 Logical Systems Inc. - - - - - - - - - - - -
569940 PA-QLD6SM18-32F-88 Logical Systems Inc. - - - - - - - - - - - -
569942 PA-SSD6SM18-28 Logical Systems Inc. - - - - - - - - - - - -
569944 PA-QSD3SM18-20 Logical Systems Inc. - - - - - - - - - - - -
569945 PA-SOD3SM18-18 Logical Systems Inc. - SOIC DIP Through Hole Solder 18 0.050" (1.27mm) - 0.100" (2.54mm) - - -
569949 PA-SOD3SM18-28 Logical Systems Inc. - SOIC DIP Through Hole Solder 28 0.050" (1.27mm) - 0.100" (2.54mm) - - -
569950 PA-SOD3SM18-24 Logical Systems Inc. - SOIC DIP Through Hole Solder 24 0.050" (1.27mm) - 0.100" (2.54mm) - - -
569953 PA-QSD3SM18-16 Logical Systems Inc. - - - - - - - - - - - -
569954 PA-SSD3SM18-14 Logical Systems Inc. - SSOP DIP Through Hole Solder 14 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570006 PA-SSD3SM18-18 Logical Systems Inc. - SSOP DIP Through Hole Solder 18 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570011 PA-SSD3SM18-28 Logical Systems Inc. - SSOP DIP Through Hole Solder 28 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570013 PA-SSD3SM18-24 Logical Systems Inc. - SSOP DIP Through Hole Solder 24 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570014 PA-SSD6SM18-24 Logical Systems Inc. - - - - - - - - - - - -
570016 PA-SOD3SM18-20 Logical Systems Inc. - SOIC DIP Through Hole Solder 20 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570017 PA-SSD3SM18-16 Logical Systems Inc. - SSOP DIP Through Hole Solder 16 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570022 PA-SOTD3SM18-06 Logical Systems Inc. - SOIC DIP Through Hole Solder 6 0.037" (0.95mm) - 0.100" (2.54mm) - - -
570034 PA-SSD3SM18-20 Logical Systems Inc. - SSOP DIP Through Hole Solder 20 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570038 PA-SOD3SM18-14 Logical Systems Inc. - SOIC DIP Through Hole Solder 14 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570040 PA-SSD3SM18-08 Logical Systems Inc. - SSOP DIP Through Hole Solder 8 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570041 PA-MSD3SM18-10 Logical Systems Inc. - MSOP DIP Through Hole Solder 10 0.020" (0.50mm) - 0.100" (2.54mm) - - -
570042 PA-MSD3SM18-08 Logical Systems Inc. - MSOP DIP Through Hole Solder 8 0.020" (0.50mm) - 0.100" (2.54mm) - - -
570060 PA-SOD3SM18-16 Logical Systems Inc. - SOIC DIP Through Hole Solder 16 0.050" (1.27mm) - 0.100" (2.54mm) - - -
570061 PA-SOD3SM18-08 Logical Systems Inc. - SOIC DIP Through Hole Solder 8 0.050" (1.27mm) - 0.100" (2.54mm) - - -

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